EL Products

1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4mm finished thickness 7. Immersion Gold 8. Plated through hole (PTH) 9. layer stack up ------solder mask ------copper 70μm (layer 1) ------dielectric thick 75μm ------aluminum core...

1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4mm finished thickness 7. Immersion Gold 8. Plated through hole (PTH) 9. layer stack up ------solder mask ------copper 70μm (layer 1) ------dielectric thick 75μm ------aluminum core...

1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4mm finished thickness 7. Immersion Gold 8. Plated through hole (PTH) 9. layer stack up ------solder mask ------copper 70μm (layer 1) ------dielectric thick 75μm ------aluminum core...

1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4mm finished thickness 7. Immersion Gold 8. Plated through hole (PTH) 9. layer stack up ------solder mask ------copper 70μm (layer 1) ------dielectric thick 75μm ------aluminum core...

1) 160*160mm, S1600 FR-4 CTI ≥ 600V, 2) 8 layer 3) Finished inner/outer: 35 μm 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 track/gap 6) 1.6mm +/-10% thick 7) Immersiong gold over nickel 8) High voltage, High temperature, moisture...

1) L1 and L4, track /space(mil) 5.1/6, precision +/-10% 90 ohm differential impedance L1, L2 and L4, track /space(mil) 6.1/7.8, precision +/-10% 100 ohm differential impedance 2). 230*230mm/1up, FR-4 Tg 170 3). 4 layers, 35 μm copper, 2.5mm thick 4). Min.track/space: 4/4 mil 5). Min. hole size: 0.25mm 6). Immersion gold 7). High...

1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-32 Layer 4). LPI Green solder mask/White legend 5). HASL, ENIG, OSP, Immersion silver 6). Blind via, Via in pad, Micro BGA 7). MOQ 1...

1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 μm copper finished 4). LPI Green solder mask/ white legend 5). Immersion gold (ENIG) 6). Differential impedance control 90 ohm/100 ohm +/-10% on track 0.1mm 7). Good for high-count layer PCB, Widely used in computer, communication equipment, precise apparatus and...

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over...

1). Size: 72*90mm/1 up 2). Layer count: 4 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8). Fastest delivery time (calendar day) 2 Layer -- 1 days 4 Layer -- 3 days 6 Layer...