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wafer cutting machine
wafer cutting machine

Minimum Order: 0
Quality/Safety Certification: 0.00


cutting machine
1.for cutting the cream -spread and laminated wafer
2. beautiful design
3.good quality
4.reasonable price

wafer cutting machine

(1) Main Function

1. Cutting machine is used for cutting the cream-spread and laminated wafer into required size .

2. It is a wire cut machine to cut the cream filled wafer sheets depending on the final size required.

3. the cutting size can be continently adjustable.This machine is pneumatcially handled so that the smooth transfer thorugh the machien is ensured .

4.The direction changing to have longitudinal and cross will be done automatically .

(2) Technical Parameter

Main Technical parameter

Electric Motor :

 

380V,0.75kW

Spreed Reducer:

 

I =24:1
Dimension :2360x2030x1040mm

(3) Trade Condition

Payment Terms

 

T/T

Loading Port

 

FOBZhaoqing Port
MQO(minmum order quantity )one set

Prodcution Capacity

 

5 sets per month
Delivery Time30 days (according to the clients' request )

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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