thermal paste/compound/grease(Retail package)
Minimum Order: 0
Quality/Safety Certification: 0.00
Thermal paste with high thermal conductivity for CPU cooler,VGA cooler,and other device, Retail package with brush for marketing
Star Brand(All the paste is authorized by SGS,and pass the Rohs certification)
Package:
1.Blister retail package for easily marketing
2.Built-in brush and syringe for freely use
3.3g,5g capacity in syringe (optional)
4.OEM is welcomed for use different stick and behind card.
Thermal compound:
SPEC:
| Parameter | Units | Condition | Test Method | Test Result | |||
| Color | N/A | 25 | Visual | Grey | |||
| Thermal Conductivity | W/m-K | No | ROCT8.140-82 | 0.965 | |||
| Thermal Impedance | -in2/W | 25 | ASTM D1470 | 0.225 | |||
| Specific Gravity | N/A | 25 | ASTM D1475 | 2.3 | |||
| Evaporation | % | 150/24Hours | Fed.Std.791 | 0.001 | |||
| Bleed | % | 150/24Hours | Fed.Std.791 | 0.05 | |||
| Dielectric Constant A | N/A | 100Hz | ASTM D150 | 5.1 | |||
| Viscosity | N/A | 25 | ____ | no flowing | |||
| Thixotropic Index | 1/10 mm | 25 | GB/T-269 | 380±10 | |||
| N/A | N/A | -50~240 | |||||
| Operation Temperture | N/A | N/A | -30~180 | ||||
| Component | |||||||
| Silicone Compounds | 50% | ||||||
| Carbon Compounds | 20% | ||||||
| Metal Oxide Compounds | 30% | ||||||
