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Hot! Oven For Drying BGA Chips Before Soldering
Hot! Oven For Drying BGA Chips Before Soldering

Minimum Order: 0
Quality/Safety Certification: 0.00


Oven
1. With special heater
2. Close loop PID control completely
3. used soldering and preheating PCB/motherboard

Oven For Drying BGA/Chips Before Soldering
Dry BGA chip before welding , so that it can  prevent the BGA/chip from Bubble and Explosion to push the moisture out

Features

With special heater, temperature distribution is even on the surface of panel; Close loop PID control completely; temperture is precision and steady; Can be used for reflow soldering and preheating of some PCBs, and also for  working procedure  needing even heating.
 Technical Parameters

Model

Size(internal)mm
L*W*H

Size(external)mm
L*W*H

Voltage

Power supply
(KW)

101-0

350*350*350

620*700*510

220V

1.0

101-1

450*450*350

720*800*510

220V

2.0

101-2

550*550*450

820*900*620

220V

2.4

101-3

750*600*500

1020*950*680

220V

3.5

101-4

1000*800*800

1320*1150*980

380V

6.0

101-5

1200*1000*800

1520*1350*980

380V

9.0

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