1.We have over 10 years experience in PCB field
2.Fast delivery and Quick turnaround
3.Our PCB board get ISO,UL,RoHs, SGS ect
Single-sided PCB FR4 (KB): 1.6mm 1oz Immersion gold-plated, V-cut, red LPI Minimum line space width: 0.15mm Gold-thickness: 4U" Specializing in high-tech PCBs for about 10 years Large production capability with hi-class production equipment Professional engineering assistance, including design rule check of customer data In-house PCB R&D center Quick turnaround For these electric applications: LCD monitors and LCD TV Sets Military systems Notebook computers' main board and networking equipment Multimedia devices (such as MP3/MP4 players, PDAs) Home appliances Telecom products such as Mobile phones Audio and video products
We can produce single-sided printed board(ssb), double-sided printed board(dsb), multilayer PCBs, HDI PCBs, FPC and PCBA according to your provided data files or your samples.
HECPCB CAPABILITY-High Volume Conventional PCB
Surface | Gold plating\HAL\OSP\Gold finger |
Raw Material | FR4, FR5(High TG), CEM-1, AI-base… |
Max. Board Size | 600mm*800mm |
Min. Board Size | 5mm*5mm |
Warp age | Single-side<1.0%,Double-side<0.6%,Multilayer<0.6% |
Min. Thickness & Tolerance | 0.2mm+0.08mm |
Min. Line Width / Space & Tolerance | HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%) |
Copper to Edge-board Spacing | 0.5mm (20mil) |
Hole side to Edge-board Spacing | 0.3mm (7.87mil) |
Min. Hole Size & Tolerance | Size: 0.1mm/4mil(laser hole) Tolerance: +0.075mm/3mil for PTH Diameter; +0.05mm/2mil for Non-PTH Diameter |
Min. Hole Space & Tolerance | 0.4mm+0.076mm (15.75mil+3mil) |
Hole Wall Thickness | 20-25um (0.79mil-1.0mil) |
Hole Position Deviation | +0.076mm (+3mil) |
Min. Round Hole Dia.(for Punch) | 1.0mm(40mil) with PCB thickness <FR-4 1.0mm; 1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil) |
Min. Square Figure hole Dia.(for Punch) | 0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm; 1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil) |
Finished Board Size Tolerance | CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil) |
V-cut Position Tolerance | +0.2mm(+8mil) |
Base Material Thickness | 0.2-3.5mm |
Base Material Copper Thickness | 18um, 35um, 70um |
Electrolytic Flash Gold with thickness of 0.4 to 3.0 micro inches | Au: 0.01 to 0.076 micron; Ni: 5~15mm |
Selective Immersion Gold with thickness of 1 to 4 micro inches | Au: 0.025 to 0.1 micron; Ni: 2.54~5.5mm |
Gold tab/finger plating with thickness of 5 to 30 micro inches | Au: 0.125 to 0.76 micron; Ni: 1.27~12mm |
Electroless Immersion Tin with thickness of 20 to 48 micro inches | 05 to 1.2 micron |
Organic solder ability Preservatives | Entek Cu 106A HT, Prefulx F2 LX |
Item | Sample Delivery Lead Time | Normal Delivery Lead Time | ||
PCB | Normal | Special | Repeat | New |
Single & Double | 4days | 2days | 7-14days | 8-15days |
4 layers | 6days | 3days | 8-15days | 9-15days |
6 layers | 8days | 4days | 10-16days | 12-18days |
8 layers | 10days | 6days | 15-25days | 15-25days |
10 layers | 14days | 8days | 16-26days | 16-26days |
12 layers | 16days | 10days | 20-28days | 22-30days |
