RW-SP360C -----Maquina de reballing BGA
*new model with Laser locator
*PLC control
*repair laptop, XBOX, PS3...
Nueva maquina de reballing BGA RW-SP360C-lleva Localizador láser
Specification:
Applicable PCB size
Max PCB size: 430mmX350mm
Applicable BGA size
Max size: 55mmX55mm
Min size: 7mmX7mm
Max weight: 80g
Power for operation: 3600W
Main heater: 800W
Lower heater: 800W
Bottom heater: 2000W
Machine dimension:L620*W580*H650mm
Machine weight: 33KGs
Input power: AC 220V 3.6KW
Description
*High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.
*Movable heating head, able to move horizontally; easy to operate;
*Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2’ high definition screen, convenient for operation and observation;
*Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input;
*The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;
*The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;
*Powerful cross flow can cool the lower heating area;
*The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;
*with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;
*Set with over temperature alarming and protection function;
*Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;
*The integrated design of machine and chassis is room-saving.