Ceramic Aluminium Nitride Plate
1.Excellent Insulation properties
2.Small dielectric constant
3.High mechanical strength
THE LEADING MANUFACTURER FOR CERAMIC PLATES OF ALN/ALUMINA/BEO MATERIALS!
The plate is mainly used in high-density hybrid circuits,microwave power devices,power semiconductor devices,power electronic devices,optoelectronic components,semiconductor refrigeration products such as substrates for high-performance materials and packaging materials.Characteristics:high thermal conductivity,good electrical properties,thermal expansion coefficient with Si-chip approach,non-toxic,is intended to replace the ideal material for ceramic BeO.
Normal Specifications:
property content | property index |
Density(g/cm3) | ≥3.30 g/cm3 |
Water absorption (%) | 0 |
Thermal conductivity(20°C, W/m.k) | ≥170 |
Linear expansion coefficient (RT-400°C,10-6/°C) | 4.4 |
Flexural strength (MPa) | ≥330 |
Bulk resistance (Ω.cm) | ≥1014 |
Dielectric constant(1MHz) | 9.0 |
Dissipation factor (1MHz) | 3×10-4 |
Dielectric strength (KV/mm) | ≥15 |
Surface roughness Ra(μm) | 0.3~0.5 (≤20nm) |
Camber (~/25.4(length)) | 0.03~0.05 |
Appearance | Dense |
Other specifications are available to produce as customers’requirements,and Copper/Nickel/Gold/Silver etc.metallization processing!
