BGA rework station RW-B500C
*Movable bottom IR preheating
*hot air nozzle, customized
*for laptop,desktop,XBOX360,PS2/3

  BGA Rework Station-RW-B500C

Advantage:

1. Auto-generated profile, multi steps of temperature control

2. Embedded industrial computer, PLC with stable performance

3. big bottom IR area movable with X axis

4. Applicable for laptop,desktop,xbox,ps2, ps3,psp,etc.

 

Warranty:

1 year, during the warranty, if any parts are damaged not artificially, our company will afford to replace a new one for you and the relative shipping cost is on our party.

 

 

Specification

PCB dimension	W50×D50~W680×D680mm
PCB thickness	0.5~4mm
Temperature control	K-type thermocouple, close cycle controlled
PCB locating way	Jig
Preheater	far infrared 2400W
Upper heater	hot air 400W
Lower heater	hot air 800W
Power supply	single-phase 220V, 50/60Hz, 4KW
Machine dimension	L750×W780×H700mm
Weight	Approx. 70Kg

 

Features

High quality heating material ensures desoldering and soldering procedures of BGA are precisely controlled; Auto-generated profile, no need to adjust or change temperature on the profile; Adjustable Air flow and temperature within a wide range to produce high temperature breeze; Movable heating head for easy operation Touch screen interface; 3 heaters;real-time temperature curve display on touch screen; Embeded industrial computer, PLC control; able to disply set profile and testing profile at the same time; analyze the profile,compared with saved history profiles; 8 segments of temperature up(down) and 8 segments constant temperature control, unlimited profiles saving; Up/down adjustable lower hot air nozzle; Buzz after soldering or desoldering is finished; With different alloy hot gas nozzles, easy to replace.It could be tailored as per the specific requirements. The whole bottom IR preheating area can move along with X axis, so as to meet the need of different BGA repair and bigger size PCB.