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BGA rework station with Color optical system(SV550A)
BGA rework station with Color optical system(SV550A)

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Quality/Safety Certification: 0.00


BGA Machine
*SIEMENS PLC
*With 2 camera vision systems
*Large size bottom IR heating area
*Auto-move optical carmera

Auto BGA Rework Station with Surveillance Camera

 

Specification

 

Applicable PCB:

W20*D20~W550*D500mm

PCB thickness: 

0.5~4mm

Working table adjustment:

±120mm forward/backward, ±80mm left/right

Temperature control:

K-type thermocouple, close cycle controlled

Upper heater(hot air):

1200W

Lower heater(hot air):

800W

Bottom IR heater: 

3600W

Power supply: 

AC singal-phase 220V 50/60Hz

Applicable BGA: 

1*1~70*70mm

Placement precision:

0.01mm

Max BGA weight:

300g

Machine Weight:

90KG

Machine Dimension:

L850*W750*H630mm

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Features

Three heating systems( upper/lower hot air heater, bottom IR heater) heating independently, time and temperature can be displayed digitally on touch screen; Optical vision system can move along with X,Y axis automatically; easy for placement and operation; Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the max PCB size it can handle up to 550×500mm; Powerful cross flow fans cool the bottom heating area rapidly with stable speed. Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA sized up to 70×70mm; Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles, and compare them with the history saved profiles;with USB for connecting mouse and updating software; Color LCD monitor; big size screen, easy to operate; Built-in vacuum pump; the max suction up to 80g; 60 °rotation in φ angle, 8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer; Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range; Auto pick up chip, auto solder, auto remove, auto placement; Alloy nozzle assures the durability and stability in reflow, able to locate in any angle; Visile monitoring system, can view the melting procee of the balls,(optional).

 

 

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