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Heat diffusion material-- Foamed copper
Heat diffusion material-- Foamed copper

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1. Number of pores per inch(PPI): 5-120
2. Density(g/cm3):0.15-0.45
3. Thickness: 0.5-- 30mm
4. Porosity: 90%-- 98%

China Beihai Building Material Co., Ltd specializes in the manufacturing of various OPEN-CELLED &CLOSED CELL  FOAMED MATAL MATERIALS. For CLOSED CELL, we mainly have closed cell aluminum foam panel, and for OPEN CELL, we have foamed Fe-NI, Special Foamed Nickel Foam, Foamed copper and foamed alloy materials, foamed aluminum panel, etc.  

 

Foamed Copper

Basic Specification:

Number of pores per inch(PPI): 5—120Density(g/cm³):0.15—0.45Thickness: 0.5-- 30mmPorosity: 90%-- 98%Standard size: ≤500*500mm; thickness under 4mm can be made into roll shape. Larger size should be discussed in advance

 

Feature:

Excellent mechanical property and processabilityExtraordinary electricity and heat conductivityMassive three- dimensional network structureExcellent base & corrosion resistant alibilityMagnificent electromagnetic shielding abilitySuperior tensile strength and favorable ductility

 

Application:

Heat diffusion, dissipation and exchange materials for electronic components such as CPU, display card and LED etc.Electrode material for batteries, such as lithium ion battery, fuel cell, nickel-zinc battery, etc.Electromagnetic shielding materialsCatalyst and its carrier materialVarious initial-efficiency, intermediate-effeciency and sub-micron filtration material Decoration materials for construction

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