made of insulating flim, and wound wires element or etched foil element.

TYPICAL APPLICATIONS

1) Semiconductor wafer processing.

2) Military, Satellites or other spacecraft where low outgassing properties are required.

3) Medical, Instruments, Laboratory research where exact uniform heating, different watt

    densities and thorough  cleaning or sterilization is needed.

4) Optical and Photographic equipment.

5) LCD display and Computer equipment.

6) Heating of electronic components.

7) Packaging, fusing, and splicing equipment etc.