BGA Rework Equipment
PLC, touch screen,industrial computer
3 hot air&IR heating, mouse control
8 segment temp rise/drop contr

Laptop BGA Rework Equipment SP360C, best popular model with customers with high repair success rate

Warranty: 1 year

Specification:
Applicable PCB size
  Max PCB size: 430mmX350mm
Applicable BGA size
  Max size: 55mmX55mm
  Min size: 7mmX7mm
Max weight: 80g
Power for operation: 3600W
Main heater: 800W
Lower heater: 800W
Bottom heater: 2000W
Machine dimension: 650*500*600m
Machine weight: 36KG
Input power: AC 220V 3.6KW

Description
l  High quality  heating material produces high-tem breeze, precisely  controlling  the  soldering
and desoldering process.
l  Movable heating head, able to move horizontally; easy to operate;
l  Embedded  industrial  computer,  touch  screen  interface,  PLC  control;  real-time  temperature
curve  display,  able  to  display  set  curve  and  practically-tested  curve;  7.2’  high  definition
screen, convenient for operation and observation;
l  Industrial computer able to store unlimited temperature curves, curve analysis can be done on
touch screen; both English and Chinese can be input;
l  The temperatures of the upper and lower heater can be precisely controlled according to set
temperatures;  bottom  constant  temperature  infrared  heating  area;  appropriate  temperature
control apparatus can ensure safe rework for BGA;
l  The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;
l  Powerful cross flow can cool the lower heating area;
l  The  adjustable  PCB  positioning  supports,  easy  and  fast  to  install  PCB;  special  fixture  for
installing allotype boards ; 
l  with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy
for picking up BGA;
l  Set with over temperature alarming and protection function;
l  Equipped with  different  hot  gas  nozzles,  easy  to  replace;  can  be  customized  according  to
specific needs;
l  The integrated design of machine and chassis is room-saving.