Heat dissipation pad
-Flame retardant silicon pad
-Heat dissipation silicon pad
-Thermal isolation pad
-ROHS & UL listed
HCH600 Heat dissipation silicon pad is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.
Features & benefits:
1.High compressibility, soft and flexible, designed for applications in low-stress application environment
2.Nice thermal conductivity
3.Electrical insulation
4.Meet with the environmental requirements of ROHS and UL
5.Natural stickiness
Typical applications:
1.Laptop
2.Communication hardware equipment
3.High-speed hard disk drive equipment
4.Automobile engine control mould
5.Micro processor, memory chip and graphics processor
6.Mobile equipment
Physical properties:
Test item | Test method | Unit | Test value of HCH series | |
HCH600 value | HCH500 value | |||
Color | Visual |
| Blue/Laterite | Blue/Yellow |
Thickness | ASTM D374 | Mm | 0.25 to 5.0 | 0.25 to 5.0 |
Specific Gravity | ASTM D792 | g/cc | 2.85 | 2.7 |
Hardness | ASTM D2240 | Shore C | 30 | 30 |
Tensile strength | ASTM D412 | kg/cm2 | 55 | 55 |
Continuous Use Temp | EN 344 | °C | -40 to 220 | -40 to 220 |
Volume Resistivity | ASTM D257 | Ω-cm | 3.1*1011 | 3.1*1011 |
Breakdown voltage | ASTM D149 | KV/mm | >5.0 | >5.0 |
Flame Rating | UL-94 |
| 94-V0 | 94-V0 |
Conductivity | ASTM D5470 | w/m-k | 6.0 | 5.0 |
Configurations available: 200mm*400mm, 300mm*400mm; specific size could be provided
according to your requirements.
Packaging:
-Carton box & Plastic bags
-430mm*230mm*120mm for 200mm*400mm size
-320mm*320mm*120mm for 300mm*300mm size
