AlN ceramic substrate
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Good dielectric properties
High thermal conductivity
Low thermal expansion coefficient, close to that of Silicon
Non-re
Specifications of Aluminum Nitride (AlN) substrates & heat sinks
Thermal conductivity (W/mk) | 180 |
Thermal expansion coefficient (mm/k) | 3.6x 10-6 |
Surface roughness | Ra0.5 to 0.03μm |
Size (mm) | 200x50 and more |
Thickness (mm) | 0.2 to 5 |
Camber (/25.4mm) | 0.04 |
Density (g/mm3) | > 3.30 |
Felxual strength (MPa) | > 300 |
Compressive strength (MPa) | > 2000 |
Volume resistivity (Ω.cm) | > 1013 |
Dielectric strength (kV/mm) | 20 |
Dielectric constant (1MHz) | 9.0 |
