TP300 Thermal Silicone Pad Thermal Conductive Pad
Minimum Order: 0
Quality/Safety Certification: 0.00
The largest developer and manufacturer of silicone thermal pad,silicone thermal conductive pad,LED lighting silicone thermal pad
Silicone thermal pad/thermal gap filler/thermal conductive pad Typical Applications:
- Between electronic components such as Semiconductor,High Power IC, CPU, IGBT, MOS and heatsink.
- Telecommunications infrastructure hardware (base stations), Telecom device, wireless Hub, power supply etc
- High Power Led Lighting, Network Hardware, Automotive (Engine control modules, ABS systems...
Typical Properties of TP300 | |||
Properties | Units | Metric Value | Test Method |
Construction & Composition | ---- | With or without Fiberglass | ---- |
Color | ---- | Light Blue | Visual |
Thickness Range | mm | 0.5~5.0 | ---- |
Hardness | Shore C | 25 | ASTM D2240 |
Density | g/cc | 2.7 | ASTM D792 |
Tensile Strength | KN/m | 0.3 | ASTM D412 |
Elongation | % | 64% | ASTM D412 |
Continuous Use Temp | °C | -40 to 150 | EN344 |
Breakdown Voltage | Kv/mm | ≥5.0 | ASTM D149 |
Volume Impedance | ohm-cm | 1.1 x 1016 | ASTM D257 |
Dielectric Constant | 1MHz | 7.15 | ASTM D150 |
Weight Damnify | ---- | ≤0.3% | @150°C 240H |
Flame Rating | ---- | V-0 | UL 94 |
Thermal Conductivity | W/m.k | 3.0 | ASTM E1461 |
UL, RoHS, REACH | ---- | Compliance | ---- |