UTP100 Thermal Gap Fiiler Pad/UTP100 Ultra Soft Thermal Pad
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The largest developer and manufacturer of Ultra Soft thermal gap filler pad,LED lighting thermal pad,thermal conductive pad
LED Ultra Soft Thermal pad /LED thermal gap filler pad/LED thermal conductive pad
Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, Wireless Hub, Power supply etc
- Cooling Modules, Thermal modules, in all applications where a metal housing is used as heatsink.
Specification sheet:
Typical Properties of UTP100 | |||
| Properties | Units | Metric Value | Test Method |
| Construction & Composition | ---- | Silicone & Fiberglass | ---- |
| Color | ---- | pink & white | Visual |
| Thickness Range | mm | 0.5~12 | ---- |
| Hardness | Shore C | 10 | ASTM D2240 |
| Density | g/cc | 2.0 | ASTM D792 |
| Tensile Strength | KN/m | 2.5 | ASTM D412 |
| Elongation | % | 60% | ASTM D412 |
| Continuous Use Temp | °C | -40 to 150 | EN344 |
| Breakdown Voltage | Kv/mm | ≥6.0 | ASTM D149 |
| Volume Impedance | ohm-cm | 6.2 x 1015 | ASTM D257 |
| Dielectric Constant | 1MHz | 5.27 | ASTM D150 |
| Weight Damnify | ---- | ≤1 | @150°C 240H |
| Flame Rating | ---- | V-0 | UL 94 |
| Thermal Conductivity | W/m.k | 1.0 | ASTM E1461 |
| UL, RoHS, REACH | ---- | Compliance | ---- |
