thermal silicone pad features:
-Thermal pad thermal conductivity:1.0 W/m.k
-Electrically isolation.

Thermal silicone pad Typical Applications:

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc

- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Thermal silicone pad specification Sheet:

-Thermal conductivity:1.0 - 5.0 W/m.k
-Thickness Range: 0.25 -12mm

-Low Hardness,Shore 00: 10

-Breakdown Voltage: > 4KV

-Naturally Tacky

-Fiberglass reinforcement available
-Available w with w/o PSA