CerDIP package
1.Low temperature glass melting sealing
2.Used in harsh environments,corrosion-resistant
3.Airtight

China Hot Seller Line8 CerDIP Package with Lid, base and Lead

CerDIP package

1.Material:4J42

2.Material thickness:0.01"

3.Leads:8-40L

Introduction of CerDIP package

CerDIP package is a common chip package form in recent years at home and abroad, it generally uses low-temperature melting glass sealing packaging technology. The overall structure consists of base, lead frame and lid. There are many types of CerDIP package , such as 8-lead, 14 lead, 16 lead, 18 lead, 22 lead, 24 lead and 28 lead and 40-lead, etc. And there are a variety of options for cavity size according to chips requirements . We can provide all kinds of products with different leads and size for users .

When you need these products, please provide the following information so that we can serve you more effectively

1. Lead Number

2.Width of package

3. Base cavity size L × W

4. Glass sealing temperature range

5.Demand quantity

6.Special requirements for lead

 Feature:

1.Low temperature glass melting  sealing
2.Can be used in harsh environments,corrosion-resistant

3.Airtight,easy to package

4.Consists of base,lead frame and lid

5.Types: 8-lead, 14 lead, 16 lead,  20 lead

6.High quality and low cost

Application:

1.Military

2.Microelectronic package which has high requirements on quality-reliablility

Specification