Laptop/notebook Thermal Pads
Good thermal interface material for laptop/notebooks
High conformability
Electrical isolating
Laptop/Notebook Thermal Pads
Features&Benefits:
1.Thermal conductivity:2.0W/m.k
2.High conformability and low hardness
3.Electrically insulating
Typical Application:
1.Laptop,module in computer
2.Between electronic components such as Semiconductor,IC,CPU,MOS and heatsink
3.Cooling Module,Thermal module,in all applications where metel housing is used as heatsink
Configurations:
-Sheet form,die-cut parts
-Tape application available
Size available:
200x400mm
Thickness available:
0.5-12.0mm,increment by 0.5mm
Properties:
Typical Properties of Gap Pad LD8200 | |||
Property | Unit | Metric Value | Test Method |
Color | *** | Dark Grey | Visual |
Thickness | mm | 0.5-10.0 | ASTM D374 |
Density | g/cc | 2.8 | ASTM D792 |
Hardness | Shore C | 25±5 | ASTM D2240 |
Tensile Strength | KN/m | 0.33 | ASTM D412 |
Continuous Use Temp. | °C | -40-150°C | EN 344 |
Electrical | |||
Breakdown Voltage | Kv/mm | ≥6.0 | ASTM D149 |
Volume Resistivity | Ω.cm | 1.0×1016 | ASTM D257 |
Flame rating | V-0 | V-0 | UL 94 |
Thermal | |||
Thermal Conductivity | W/m.k | 2.0 | ASTM D5470 |
