Diode End-Pump Laser Scribing-Cell Machine (SES10)
Minimum Order: 0
Quality/Safety Certification: 0.00
1; Adopts diode end pump laser module
2; High speed for scribing
3; High precision
Equipment Performance:
1; Adopts diode end pump laser module
2; High level integration
3; Better laser beam quality
4; Lower running cost
5; Longer time without maintenance
6; The main key parts are imported
7; The simple structure for the whole machine
8; High speed for scribing
9; High precision
10; Continuous running for 24 hours
Applicable fields:
Scribing for mono-crystalline silicon, poly-crystalline silicon, amorphous-crystalline silicon, solar cell, wafer in solar industry.
The main technical parameters
Model number | SES10 |
Wavelength | 1.064μ m |
Scribing precision | ± 10μ m |
Max cutting thickness | 1.2mm |
Line width | ≤ 0.03mm |
Laser frequency | 20kHz~100kHz |
Max speed | 230mm/s |
Max laser power | ≤ 10W |
Worktable size | 350× 350mm |
Worktable moving speed | ≥ 80mm/s |
Power supply | 220V/ 50Hz/ 3kVA |
Cooling system | forced air cooling |