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Diode End-Pump Laser Scribing-Cell Machine (SES10)
Diode End-Pump Laser Scribing-Cell Machine (SES10)

Minimum Order: 0
Quality/Safety Certification: 0.00


1; Adopts diode end pump laser module
2; High speed for scribing
3; High precision

Equipment Performance:

 

1; Adopts diode end pump laser module
2; High level integration
3; Better laser beam quality
4; Lower running cost
5; Longer time without maintenance
6; The main key parts are imported
7; The simple structure for the whole machine
8; High speed for scribing
9; High precision
10; Continuous running for 24 hours

Applicable fields:

 

Scribing for mono-crystalline silicon, poly-crystalline silicon, amorphous-crystalline silicon, solar cell, wafer in solar industry.


The main technical parameters

 

Model numberSES10
Wavelength1.064μ m
Scribing precision± 10μ m
Max cutting thickness1.2mm
Line width≤ 0.03mm
Laser frequency20kHz~100kHz
Max speed230mm/s
Max laser power≤ 10W
Worktable size350× 350mm
Worktable moving speed≥ 80mm/s
Power supply220V/ 50Hz/ 3kVA
Cooling systemforced air cooling
   

 

 

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