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Laser Cutting System for BGA
Laser Cutting System for BGA

Minimum Order: 0
Quality/Safety Certification: 0.00


Green Laser Cutter
BGA and FBGA Cutting System
Fast speed
Replace the sawblade cutting
CE certificate and high efficiency

 It is mainly used for cutting the PCB and BGA plate. The scanner head has the fast speed and the X-Y working table has very high precision.

Laser wave length:  515nm

Laser output power: 30W

Cutting Speed: 500mm/s according to the experience

 

 Working Principle:

 Laser beam is moving by the scanner head. And the PCB and BGA can be moveing along with the X-Y worktable.


 The system Performance:


 1)Independent intellectual property rights, the whole performance to international standards.
 2,)Using special granite pedestal, which can effectively reduce inertial vibration of the table to start, stop and accelerate; while keeping the temperature stability of the machine.
 3,)The unique software control, to ensure the accuracy of the premise has a high cutting speed and exact the cutting position by the CCD and software controlled, greatly boosting productivity.
 4)A powerful software programming function of laser power, respectively, movement, measurement, probe movement and other automation control program has greatly enhanced the laser trimming machine applications.

 The system applications and markets:
 Mainly used in PCB cutting, BGA singulation etc.

 

 

 

Lead time: 2 months

 

Payment term: 30% before in advance, 70% before delivery.

 

Guarantee: One year from the date the machine arrives the destination.

 

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