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Buliding material laser marking machine
Buliding material laser marking machine

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Quality/Safety Certification: 0.00


Buliding material laser marking machine info:
used for marking on all metallic and some non-metallic products;
good quality

Buliding material laser marking machine using the most advanced semiconductor laser technology,and the imported semiconductor laser diode pumped Nd: YAG medium with a wavelength of 808nm is employed.The optical path system adopts a hermetically sealed structure ,with optical path preview and focus indication functions,more beautiful appearance and the operation is more convenient.This machine is equipped with the latest external cooled system,low operation noise, high precision temperature control ,providing reliable guarantee for long time operation .It is integrated structure for laser,electrical source and workbench,high efficiency marking,and laser marking effect is good .The machine has high electric/optical conversion rate .Through computer controlling to change the road of the laser beam to realize automatic marking .The marks mean a breakthrough in the laser marking field,with advantages such as low energy consumption,high reliability ,small size of the facula,high pricision marking , speed ,etc .which provide 24-hour continuous operation of the marks.

Applicable materials and industries 

a.Metallic and non-metallic materials. Especially applicable to processing products requiring fineness and high precision.
b.Applicable to electronic components, ICs, electric appliances, handsets, hardware, tools, parts, precision machinery, lens, clocks, watches, jewelries, auto parts, plastic buttons, building materials, PVC pipelines, and medical instruments.
c.Plain metals and their alloys (iron, steel, aluminum, magnesium and zinc), rare metals and their alloys (gold, silver and titanium), metallic oxides, special surface treatment (phosphorized, aluminum anodized and galvanized surfaces), ABS (cases for electric appliances and daily articles), printing ink (transparent buttons and printed matters), and epoxy resin (encapsulation of electronic components, and insulating layers).

Technical specification

       Max.laser power

     50W

      75W

       Laser wavelength

  1064nm beam quality M2,Less than6

       Laser repetition frequency

          ≤30kHz

       Standard marking range

          100mm×100mm

       Optional marking range

          50mm×50mm/100mm×100mm

       Marking depth

        ≤0.3mm

       ≤0.5mm

       Marking line speed

                ≤7000mm/s

       Min.line width

                 0.015mn

       Repeatable accuracy

                ±0.003mm

       Overall system power

                 2.5KW

       Power requirement

           220V/single phase /50Hz/20A

       Host system dimensions

       880mm×950mm×(1040-1350)mm

       Cooling system dimensions

               650mm×450mm×920mm

 

   

 

 

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