Buliding material laser marking machine info:
used for marking on all metallic and some non-metallic products;
good quality
Buliding material laser marking machine using the most advanced semiconductor laser technology,and the imported semiconductor laser diode pumped Nd: YAG medium with a wavelength of 808nm is employed.The optical path system adopts a hermetically sealed structure ,with optical path preview and focus indication functions,more beautiful appearance and the operation is more convenient.This machine is equipped with the latest external cooled system,low operation noise, high precision temperature control ,providing reliable guarantee for long time operation .It is integrated structure for laser,electrical source and workbench,high efficiency marking,and laser marking effect is good .The machine has high electric/optical conversion rate .Through computer controlling to change the road of the laser beam to realize automatic marking .The marks mean a breakthrough in the laser marking field,with advantages such as low energy consumption,high reliability ,small size of the facula,high pricision marking , speed ,etc .which provide 24-hour continuous operation of the marks.
Applicable materials and industries
a.Metallic and non-metallic materials. Especially applicable to processing products requiring fineness and high precision.
b.Applicable to electronic components, ICs, electric appliances, handsets, hardware, tools, parts, precision machinery, lens, clocks, watches, jewelries, auto parts, plastic buttons, building materials, PVC pipelines, and medical instruments.
c.Plain metals and their alloys (iron, steel, aluminum, magnesium and zinc), rare metals and their alloys (gold, silver and titanium), metallic oxides, special surface treatment (phosphorized, aluminum anodized and galvanized surfaces), ABS (cases for electric appliances and daily articles), printing ink (transparent buttons and printed matters), and epoxy resin (encapsulation of electronic components, and insulating layers).
Technical specification
Max.laser power | 50W | 75W |
Laser wavelength | 1064nm beam quality M2,Less than6 | |
Laser repetition frequency | ≤30kHz | |
Standard marking range | 100mm×100mm | |
Optional marking range | 50mm×50mm/100mm×100mm | |
Marking depth | ≤0.3mm | ≤0.5mm |
Marking line speed | ≤7000mm/s | |
Min.line width | 0.015mn | |
Repeatable accuracy | ±0.003mm | |
Overall system power | 2.5KW | |
Power requirement | 220V/single phase /50Hz/20A | |
Host system dimensions | 880mm×950mm×(1040-1350)mm | |
Cooling system dimensions | 650mm×450mm×920mm |