XBQ-BP thermal conductive tape provides high thermal conductive efficiency and creates a good heat transfer path.

 

Product Description:

 

      XBQ-BP series is suitable to apply to electronic mechanical components assembly such as the heat sink module and LED light bar module to provide a better heat-transfer path between heat-generating components and heat sink or other cooling devices.

 

 

Features:

Different kinds of thickness standard is availableVarious structures are for different applicationsStable and EconomicalSuperior adhesion strength and high thermal conductive efficiency

Applications:

Assembly of the heat sink and DDR-RAM moduleAssembly of the LED light bar module and metal frame bezelDie-cut pieces and Laminates