ZY-270A is a self-developed high-cost economy Bonder. The device core components takes imported parts.

 technical parameter 

windowsXP       Computer system

 Operation surface:English surface 

300MSEC  Working cycle:300MSEC

±5° Angle accuracy :±5°

±1.5mil  Position accuracy : ±1.5mil

6mil*6mil~ 100mil*100mil    :Wafer Size: 6mil*6mil~ 100mil*100mil

LED,SMD,PCB

Application holder:LED,SMD ,PCB ,dot matrix, Piranha LED and high-power 

Double vision system : Precise and adjustable wafer image recognition positioning system

220V±10V,50HZ  Power supplier 

1.3KW        Max power consumption 

3-5kgf/cm2      air resource   

-80~-90Kpa     vacuum 

 other function and configuration

Leak wafer detection and self-clean suction nozzle

Storage of limitless program 

17 inch LCD

external vacuum system 

Bonder system 

Bonder head 

Bonder arm 

20G-210G  Bonder strength 

Wafer XY working size 

6″*6″(152mm*152mm)Max route 

±0.3mil  accuracy

±0.2mil  retest accuracy 

6″or 4″Wafer size 

4mm thimble route 

Bonder size 250MM*152MM

10″*6″Max XY route

250MM*152MM

±0.3mil Accuracy 

±0.2mil repeatablebility 

30degree Bonder arm