Copper Clad Laminated Sheet
FR4 Copper Clad Laminate
Thickness:0.6,0.8,1.0,1.2,1.6,2.0mm.
H/H,H/0,0/0,1/1,1/H.
Copper Clad Laminated SheetI
FR4 Copper Clad Laminate
Thickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm .
Thickness of copper:18um, 35um, other thickness is according to order.
Face: 1 and 2
Size: 1020mm*1220mm
Features:
1) The end face of foil covered board should be tidy without any delamination
and crackle .
2) Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily.
removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3) On laminated face, the defects such as bubble, impressed pitting, nick and
glue lack and outer impurity which retard its use are not allowed .
4) Usually used in PCB of computers, home electric appliances and other lines.
FR4 ccl technical date:
| FR4 TECHNICAL DATA SHEET | ||||
| NO | ITEM | UNIT | INDEX | |
| 1 | Surface resistance after damp heat and recovery | MΩ | 1.3x105 | |
| 2 | Volume resistivity after damp heat and recovery | MΩ.m | 1.63x106 | |
| 3 | Permitivityafter damp heat and recovery | / | Max: 5.5 | |
| 4 | Dissipation factor after damp heat and recovery | / | 0.017 | |
| 5 | Pulling strength | N | Min: 60 | |
| 6 | Peel strength after exposure to solvent vapour | N/mm | Min: 1.4 | |
| 7 | Blistering after 10s heat shock | / | No blistering or delamination | |
| 8 | Solderability (wetting test) | S | 2 | |
| 9 | Flexural strength | MPa | Min: 300 | |
| 10 | Flammability(vertical burning test) | / | FV0 or FV1 | |
| 11 | Water absorption | mg | Max:5.9 | |
| 12 | Measling | / | No measling or blistering or delamination | |
| 13 | Warpage | Bow | mm | Max: 18 |
| Twist | Max: 20 | |||
