PCB board immersion Au Computer PCB
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PCB board immersion Au Computer PCB
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PCB board immersion Au Computer PCB PCB board immersion Au Computer PCBPCB board immersion Au Computer PCBPCB board immersion Au Computer PCB
| No. | Item | craft standard | |||||
| 1 | Surface finish | spurt Pb, Immersion Au, plating Au, Immersion Ag, OSP, Plating Tin | |||||
| 3 | PCB thickness | Max | 3.5mm | ||||
| inner board(Including copper thickness) | 0.2MM | ||||||
| 4 | PCB size | pannel size Max. | Not two direction> 540MM (at the same time) | ||||
| pannel size Min. | at least one direction >100mm | ||||||
| Standard pannel size | Max.18"*24" | ||||||
| 5 | Drilling | Drilling Bits Min. | 0.25mm | ||||
| Drilling slot knife Min. | 0.7MM | ||||||
| Drilling Bits Max. | 6.35mm | ||||||
| Hole location tolerance Min | ±0.076mm | ||||||
| Diameter Min. | ±0.05MM | ||||||
| 6 | Immersion Copper | PTH thickness | Max. 25.4UM | ||||
| PCB thickness:hole diameter | 5:1(max) | ||||||
| 7 | Line | Line width Min. | 4MIL | ||||
| Line space Min. | 4MIL | ||||||
| NPTH hole unilateral dry film hole sealing | >=6mil , standard. >8MIL | ||||||
| dry film hole sealing capacity | Max. Hole(5.0MM),slot(5.0*3.0MM) | ||||||
| etching tolerance | Min. ±20% or +/-1MIL | ||||||
| layers para-position tolerance | 3MIL | ||||||
| 8 | Electroplating | copper thickness of PTH | 12UM(min),25.4(max) | ||||
| electroplating Au | Ni thickness | 100U“ | |||||
| Au thickness | 0.6-1.5U" | ||||||
| Immersion Au | Ni thickness | 100-250U" | |||||
| Au thickness | 1-3U" | ||||||
| Immersion Ag | thickness | 8-10U" | |||||
| Immersion Pb | thickness | 0.8-1.0UM | |||||
| electroplating Pin | Ni thickness | 100U" | |||||
| Au thickness | 2-10U" | ||||||
| 9 | solder resist | solder resist width | >=4MIL | ||||
| solder resist thickness | 8-30UM(line surface),corner <=7UM | ||||||
| single window of pad | 2MIL | ||||||
| space of line and solder resist window | 3MIL | ||||||
| solder resist filled in hole | Max.0.5MM | ||||||
| 10 | character | line width of character | >=5MIL | ||||
| space of character and pad | 5MIL | ||||||
| 11 | thickness of spurting Pb |
| |||||
| 12 | outline | outline tolerance | CNC recutting tolerance Min. | ±5MIL(0.13MM) | |||
| punching tolerance | ±0.13MM | ||||||
| recutting diameter (Min.) | 0.8MM | ||||||
| V-CUT | PCB size Max. | shorttest side can be less than 70MM | |||||
| remaining thickness Min. | 0.25MM(MIN) | ||||||
| Fluctuation contrapuntal tolerance | ±0.15MM | ||||||
| angle | 30\45\60±5° | ||||||
| chamfer angle | depth | 0.8±0.2MM | |||||
| angle | 20±5 | ||||||
| 13 | ET | voltage of test | 250V | ||||
| size of PCB for flying-probe test Min. | two sides can't be less than 50MM,otherwise,first milling outline ,V-CUT,then recutting outline | ||||||
| open resistance | 30-50 | ||||||
| short resistance | 30 | ||||||
| SMT spacing | 0.2MM(MIN) | ||||||
| test pin Min. | 0.45MM | ||||||
| 14 | warpage | single-sided board | 1-1.5%, Min.0.75% | ||||
| other boards | 0.75% | ||||||
| method of calculation | height of warpage÷length of board | ||||||
| 15 | PCB thickness tolerance | thickness≤1.0MM | ±0.1MM | ||||
| thickness>1.0MM | ±10% | ||||||
| 16 | Carbon ink | carbon ink cover pad at single side | 10MIL(MIN),space of carbon ink and copper (or line) should be less than 15MIL | ||||
| 17 | blue plastic | taphole | <=5.0MM | ||||
| blue plastic cover pad at single side | >=10MIL | ||||||
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