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Pulse Heat TAB Bonding Machine
Pulse Heat TAB Bonding Machine

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Pulse Heat TAB Bonding Machine
The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.

Pulse Heat TAB Bonding Machine 

Application:

The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.

  

Description:

Double cylinders of pressure system can eliminate the self-gravity. Minimum pressure accuracy is 0.1kg.Multi-level pulse source design meet the pressure requirement of diversified products.Servo memory function and auto-location function meet the efficiency of alignment, assembly and repair work.Japanese precise SMC pressure components. Interstice vacuum suction of bond head rotary work, save one second suction time  and reduce the gas wastage.

 

 

Basic Parameter

Voltage

AC220V 50-60HZ

Operation

Mode

7" interface

Rating Power

1.5KW (constant heat)

4kw (pulse heat)

LCD Table

Servo memory and auto-location system

Input Gas

0.4-0.8Mpa

TAB Fixture

Micrometer adjust X-Y-θaxis

Bond Head

60 mm(constant heat)

50mm(pulse heat)

Thermocouple

K type

Rolling Mode

Auto

Program Control

PLC and servo controller

Vision System

Two C/L CCD

Weight

Approx. 300kg

Heat Mode

Constant heat and

pulse heat

Dimension

L1200 x W895  x H1440mm

Machine Parameters and specification made to customer request.

 

 

Payment Term: T/T(50% initial payment, 50% after testing before shipment)

Price Term: FOB Shenzhen

L/T: 30-35 days after receiving deposit.

 

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