Pulse Heat TAB Bonding Machine
The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.
Pulse Heat TAB Bonding Machine
Application:
The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.
Description:
Double cylinders of pressure system can eliminate the self-gravity. Minimum pressure accuracy is 0.1kg.Multi-level pulse source design meet the pressure requirement of diversified products.Servo memory function and auto-location function meet the efficiency of alignment, assembly and repair work.Japanese precise SMC pressure components. Interstice vacuum suction of bond head rotary work, save one second suction time and reduce the gas wastage.
Basic Parameter
Voltage | AC220V 50-60HZ | Operation Mode | 7" interface |
Rating Power | 1.5KW (constant heat) 4kw (pulse heat) | LCD Table | Servo memory and auto-location system |
Input Gas | 0.4-0.8Mpa | TAB Fixture | Micrometer adjust X-Y-θaxis |
Bond Head | 60 mm(constant heat) 50mm(pulse heat) | Thermocouple | K type |
Rolling Mode | Auto | Program Control | PLC and servo controller |
Vision System | Two C/L CCD | Weight | Approx. 300kg |
Heat Mode | Constant heat and pulse heat | Dimension | L1200 x W895 x H1440mm |
Machine Parameters and specification made to customer request.
Payment Term: T/T(50% initial payment, 50% after testing before shipment)
Price Term: FOB Shenzhen
L/T: 30-35 days after receiving deposit.