Carrier: Backing/Non-backing;
Thickness: 0.10mm/0.15mm/0.20mm/0.30mm
Thermal conductivity: 1.0W/M.K
Thermal Conductive Adhesive Tapes
Features & Benefits:
-High bond strength to surfaces
-Thermal conductive and electrically isolating
-Excellent wet-out and high thermal performance
Typical Application Includes:
-Where need mount heat sink onto BGA graphic/drive processor -Where need mount heat spreader onto power converter PCB/Motor
-LED Lighting
Configurations:
-Sheet form/roll form/die-cut parts
Available Thickness:
-0.1, 0.15, 0.2, 0.25, 0.3mm -Max.width:1030mm
Typical properties of 8F10 | ||||||||
Properties | 8F10-T10 | 8F10-T15 | 8F10-T20 | 8F10-T25 | 8F10-T30 | |||
Reinforced Material | Fiberglass | Fiberglass | Fiberglass | Fiberglass | Fiberglass | |||
Thickness | 0.1mm | 0.15mm | 0.2mm | 0.25mm | 0.3mm | |||
Peel Strength (PSTC-101)(N/25mm) | >13.72 | >13.72 | >13.72 | >13.72 | >13.72 | |||
Temp Resistance(S) °C (°F) | 180(356) | 180(356) | 180(356) | 180(356) | 180(356) | |||
Temp Resistance(L) °C (°F) | 120(248) | 120(248) | 120(248) | 120(248) | 120(248) | |||
Continues Use. Temp. (°C) | -20 to 120 | -20 to 120 | -20 to 120 | -20 to 120 | -20 to 120 | |||
Adhesion | ||||||||
Retention (1Kg/Inch/25°C) | >48 | >48 | >48 | >48 | >48 | |||
Adhesion(Kg/Inch) | 1.1 | 1.4 | 1.4 | 1.4 | 1.4 | |||
Initial Bonding Strength(Kg/Inch) | 0.6 | 1.3 | 1.3 | 1.3 | 1.3 | |||
Electricity | ||||||||
Breakdown Voltage | 2 | 2.5 | 3.5 | 4 | 6 | |||
Thermal | ||||||||
Thermal conductivity (ASTM D5470) | 1.5W/M.K | 1.5W/M.K | 1.5W/M.K | 1.5W/M.K | 1.5W/M.K | |||
