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Aluminum base copper clad laminate
Aluminum base copper clad laminate

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ALUMINUM BASE COPPER CLAD LAMINATES:
Our main PCB customer: Aspcomp, Eurocir,daeduck,
Support to: Auti LG

Cerificates:

UL approval (E 136069) ISO 2000

Product Type:
HA42 Thermal conductivity  ≤ 1.0~2.0W/M.K

 

Features:

Excellent thermal conductivity

Excellent dimensional stability

Excellent mechanical properties

Excellent electromagnetic shielding

 

Main Property:

 

Item

 Test Condition

Unit

Spec

Typical Value

Thermal Impedance

A

/W

≤2.0

-

 Internal TO-220

≤1.0

0.90

Thermal Conducivity

A

W/M.K

-

-

 ASTM 5470-D

1.0-2.0

1.10

Peel Strength

A

N/mm

≥1.40

1.84

IPC-TM-650 2.4.8

1.73

Surface Resistivity

C96/35/90

≥104

10 6

E-24/125

≥103

10 5

IPC-TM-650 2.5.17.1

Volume Resistivity

C96/35/90

MΩ-cm

≥106

10 7

E-24/125

≥103

10 5

IPC-TM-650 2.5.17.1

Elecctrical Strdngth

A

KV/mm

≥30

45

IPC-TM-650 2.5.6.2

Dielectric Constant

IPC-TM-650 2.5.5.2

-

-

7

Arc Resistance

D48/50+D0.5/23

S

≥60

120

IPC-TM-650 2.5.1

Flammability

UL94

 

V-0

V-0

IPC-TM-650 2.3.10

      Tg

DSC

  

135±5

135

 IPC-TM-650 2.4.25

Water Absorption

D-24/23

%

≤0.5

0.18

 IPC-TM-650 2.6.2.1

CTI

A

-

≥175

200

IEC-60112

 

Application:

LED Lighting circuit

Power supply

Hybrid integrated circuits

Solid State Relays

 

Specification:

Aluminum Substrate Thickness: 1.0mm 1.2mm 1.5mm 2.0mm

Copper Foil: 18um 35um 70um 105um

Standard Size: 500X600mm  500X1200mm 600X1200mm 1100X1200mm 

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