Stamping Base plate.
1)Material:SECC;Thickness:0.8mm.
2)Molding process:blanking;punching;pressure line;bending;pressure side.

Stamping Base plate:

1. Material:SECC.

2. Thickness:0.8mm.

3. Molding process:blanking:punching;pressure line;bending; pressure side;

4. Stamping die stype: engineering mode

5. Certification: ISO9001, ISO14001, ISO13485, TS16949.

6. Quality control: 100% in house inspection; SPC, MSA software system controlling

stamping parts; stampings plus assembly parts.