BGA Oven:
Temperture is precision and steady
Used for reflow soldering,preheating of some PCBs, working procedure needing
WDS BGA Oven
Specifications:
Heating board dimension:L200×W150mm
Temperature range:0°C-400°C
Environment temperature: -10°C-60°C
Temperature stability: ±2°C
Heating board material: AL
Heating power: 1000w
Machine dimension: L327*W200*H110mm
Weight: Approx 5Kg
Features
•With special heater, temperature distribution is even on the surface of panel;
•Close loop PID control completely , temperture is precision and steady;
•Can be used for reflow soldering and preheating of some PCBs, and also for working procedure needing even heating.
Technical parameter:
Model | Size(internal)mm | Size(external)mm | Voltage | Power supply |
101-0 | 350*350*350 | 620*700*510 | 220V | 1.0 |
101-1 | 450*450*350 | 720*800*510 | 220V | 2.0 |
101-2 | 550*550*450 | 820*900*620 | 220V | 2.4 |
101-3 | 750*600*500 | 1020*950*680 | 220V | 3.5 |
101-4 | 1000*800*800 | 1320*1150*980 | 380V | 6.0 |
101-5 | 1200*1000*800 | 1520*1350*980 | 380V | 9.0 |
