Optical position system;
Mix IR and hot air heating;
PLC control;
used for BGA on motherboard reworking
WDS-650 Easy Operate Low Cost Motherboard Laptop BGA Rework Station Desoldering Tool
Features:
Heating head and mounting head 2 in 1. Controlled by stepping motor, can solder and unsolder automatically.Upper heating head is a new type product with mix IR and hot air heating, temperature goes up quickly that creates big temperature different between BGA and the component around that will remain unaffected, suitable for the component with very small space between BGA.Three heating zone (upper hot air + lower hot air + bottom IR) heat separately the time and the temperature displayed on the touch screen.Large and Movable bottom pre-heats area, PCB fixing jig is adjustable with X.Y axis, and the Max PCB size is up to 550*500mm.Bottom power cross flow fan cools down instantly and safelyColors optical vision system with prismatic double colors, zoom in and fine-adjusting functions, aberration distinguish setting included, auto focus, software operation, 27x optical zoom, max BGA size 70*70 can be reworked.Embedded industrial computer, touch screen interface, PLC control, display real-time temperature curve as well as setting curve and practically-tested curve which can be analyzed.Built-in vacuum pump. Rotate in 360°, mounting nozzle with precise fine-adjusting.8 segments temperature up (down) + 8segments_constant temperature control, temperature can be saved in great qty, analysis can be carried out on touch screen.Nozzle can detect the heights when picking and placing easily and located in any angels. Many sizes Alloy hot air system moved automatically with motor controlLocating chips automatically with jigs with locating scales.Temperature testing port, real-time monitoring and analyzingTechnology parameter
Style NO. | WDS-650 |
Maximum PCB size | L550*W 500mm |
PCB thickness | 0.5~2.5 mm |
Chips apply | 1*1~70*70mm |
Chip minimum space apply | 0.15mm |
Mounting maximum weight | 500g |
Mounting precision | ±0.0 1mm |
PCB locating way | outer |
Working station micro-adjust | Forward/backward ±15mm, left/right±15mm |
Temperature controlling way | K-type thermocouple, closed loop control |
Lower hot air heating | Hot air 800W |
Upper hot air heating | Hot air 1200W( 110V) |
Bottom pre-heating | IR 3600W |
Power applies | Single phase: 220V, 50/60 Hz |
Machine size | L850*W750*H630mm |
Machine weight | Approx×80 KG |