We are manufacturer of Printed circuit boards , we have made kinds of LED PCB with our new technology with low cost.
Advantages
Competitive price with best quality: USD 25~250/sqm
Fast respond and short lead time: 3-10 workdays
Certificated with UL, IPC, ROHS, SGS and ISO9001
Free sample for the first time
Detailed Specification
Product Categories: | single/double sided board, multi-layer board, high density board, including MLB with blind/buried via holes |
Main base material: | FR-1, FR-2, FR-4, CEM-1, CEM-3, High Frequency Laminate with various dielectric constant (εr) (imported or from local supplier), Aluminum base laminate, Metal core Aluminum |
Surface Finish: | Hot air Lev p lead free HASL, immersion gold/silver/tin, plating gold, OSP |
Board Thickness: | Inner core thickness 0.15-1.5mm, finished board thickness 0.20-3mm |
Copper Foil Thickness: | 1/3 OZ–5 OZ (18um – 175um) |
Min. hole size: | 0.2mm/8mil |
Min. line width: | 0.1mm/4mil |
Min. spacing: | 0.1mm/4mil |
Maximum Size: | 600mm x 10000mm |
Min. Size: | 5mm x 10mm |
Solder Mask Type: | Liquid photo-imageable, Thermosetting solder, UV solder mask |
Outline Tolerance: | ±0.13mm(r0. ±0.13mm(routing), ±0.05mm(punching) |
Inner Layer registration tolerance: | ±0.05mm |
Production capacity per month: | ≥10000square meters |
Welcome to our website http://grandwork.en.alibaba.com/
LED PCB
Advantages
1.Competitive price with best quality: USD 25~250/sqm
2.Fast respond and short lead time: 3-10 workdays
3.Certificated with UL, IPC, ROHS, SGS and ISO9001
4.Free sample for the first time
Features of Aluminum Material
1. Material --- imported high thermal conductive material is used as insulating material and the base material is also high in quality.
2. Ink--- Adopt Taiwan-made ultra white ink which posses the features of thermal shock resistant and anti-yellow, in particular for high-class LED lightening products.
3. Thermal Conductive ---material with above 2.0 (W/m·K), up to 8(W/m·K)
Item | Test Condition | Unit | Test Result |
Insulation Thickness | / | um | 75-150 |
Thermal Stress | 288°C No Blistering | S | 120S |
Thermal Conductivity | A | W/m·K | 2.0~2.5 |
Surface Resistance | C-96/35/90 | ohm | 3.5x1014 |
Heat Resistance | / | °C/W | 0.5~0.7 |
Break-down Voltage | AC | KV | 3 |
CTI | IEC60112 | V | 250 |
Peel Strength | A | N/mm Lb/in | 1.4 8 |
Dielectric Constant 1 MHz | C-96/35/90 | / | ≤4.6 |
