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mcu design/led lantern pcb design and manufacturing
mcu design/led lantern pcb design and manufacturing

Minimum Order: 0
Quality/Safety Certification: 0.00


1.provide high-quality printed circuit board;
2.advanced printed circuit board production line;
3.world-class production line.

Printed Circuit Board Service

 

Specifications

 

Product

Single sided to 12 layers PCB

Material

FR1, FR2, CEM1, CEM3, FR4, BT

Board thickness

0.4mm to 3.2mm

Base copper

H oz to 6oz

Min. hole size

Min LW/LS

0.3mm

0.1mm(Flash Gold)/0.15mm(HASL)

Aspect ratio

1 : 6

Soldermask

LPI type, Baked type, Peelable mask

Surface finishing

HASL, Flash gold, Immersion gold, Gold finger, Carbon ink

 

 

Bow & twist

0.7% (1.5mm board)

Hole size tol.

PTH: +/-0.08mm, NPTH: +/-0.05mm

Hole location tol.

+/-0.05mm

Gold thickness

0.05um to 1.5um

Nickel thickness

1um to 5um

 Output capacity

 4 Japanese JUKI high speed chip production lines consist of 1 automated printer, 2 high speed chip machines, 1 multi-purpose chip machine and 1 reflow machine.

Daily output of 160,000 chips

control systems in place

 

 

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