Description 

Specification Inch (mm) 

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-1/Aluminium

Layer No.

1-22

Board thickness

0.015"(0.4mm)-0.125’’(3.2mm)

Board Thickness Tolerance

±10%

Cooper thickness

1/2OZ-4OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.005"(0.125mm)

Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)

SMD Pitch (a)

0.012"(0.3mm)

BGA Pitch (b)

0.027"(0.675mm)

Regesiter torlerance

0.05mm

Solder Mask

Min Solder Mask Dam (a)

0.005"(0.125mm)

Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:1

Hole Registration

0.004"(0.1mm)

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  3-7um  Au:1-3u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Certificate 

ROHS  ISO9001:2000  TS16949  SGS  UL certificate