mono 125*125 solar wafer
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Solar wafer,
We can provide you solar japan fuji wafer 156*156 and 125*125mm for home or commercial or industrial etc
Solar wafer
| Property | Specification |
| Crystal and material properties | |
| Crystallinity | Multicrystalline |
| Conductivity type | P-type |
| Dopant | Boron |
| Specific resistance | 1.0 - 3.0 Wcm; 90% within 1-1.8 ohm-cm |
| Crystal size | £ 10 crystals per cm² |
| Oxygen concentration | £ 9.8 x 1017 atoms/cm³ |
| Carbon concentration | £ 5 x 1016 atoms/cm³ |
| Effective minority carrier lifetime | 1: ³ 1 µs |
| 2: Average > 3.5 µs | |
| 3: No lifetime dip > 3 µs | |
| Geometry | |
| Shape | Square with 45±10° chamfer at the corner |
| Length of wafer edge | 156 +/- 0,5 mm Cpk≥1.33 |
| Minimum square area covered | Min (d-0.5 mm)x(d-0.5 mm), Max (d+0.5 mm)x(d+0.5 mm) |
| Square area, outside of | |
| which no part of the wafer | |
| can extend | |
| Bevel edge width | 1.5 ± 0.5 mm |
| Average thickness | 200 ± 20 µm with Cpk≥1.33 |
| Total thickness variation TTV | ≤50 µm with Cpk≥1.33 |
| Warp/Bow | ≤40 µm with Cpk≥1.33 |
| Appearance | |
| Edge defect (through wafer) | ≤5 mm with ≤0.5 mm |
| Surface chipping | None above 0.2 mm wide and 0.1 mm deep |
| Saw marks | depth £ 20 µm |
| Saw marks (steps) | depth £ 15 µm |
| Cracks and pin holes | No visual cracks and |
| pin holes | |
| Surface properties | |
| Wafer slicing | Glycol based wafering |
| Wafer cleaning | Water + detergent |
| Wafer surface | As cut, no stains with the |
| exception of water stains | |
| and stains of silicon dust | |
| Packaging | |
| Packaging method | Cardboard boxes packed |
| in cardboard cartons | |
| Labelling on each | Date / Time, Ingot number, |
| cardboard boxes | Box number, Number of |
| wafers, Thickness | |
| Labelling on each | Carton Number, Wafer |
| cardboard cartons | description, Article number |
| Number of wafers, Date |
