ZX-D2 remove and place chips
touch screen operate
hot air & IR
USB export and save
bga rework station for repair motherboard
ZX-D2 rremove and place chips,bga rework station
Features:
1. With PLC user interface control, display actual temperature of three zone and a test temperature curve, can export temperature profile;
2. With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;
3. Three heating zone with independent PID to control heating process, more stable and accurate;
4. Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;
5. After removal and welding with cooling fan to cool PCB board, ensure welding effect;
6. Temperature profile parameter with password protection;
7. Equipped with a variety size of hot-air nozzle, or made according to special requirements;
8. Build-in vacuum pump, no need gas sources.
SPECIFICATION
PCB Size | ≤L500×W300mm |
PCB Thickness | 0.1~5mm |
Temperature Control | K thermocouple PID Closed loop |
PCB Positioning mode | Outer |
Bottom preheat | Infrared 2400W |
Main (Top+bottom) heater | Hot air 800W+800W |
Power supply | Single phase 220V,50/60Hz,4.0KVA |
Dimension | L650×W700×H550mm |
Weight | Approx. 40kgs |