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ZX-D2 reballing bga rework station touch screen hot air & IR repair motherboard laptop ps3 xbox360 remove and replace chips
ZX-D2 reballing bga rework station touch screen hot air & IR repair motherboard laptop ps3 xbox360 remove and replace chips

Minimum Order: 0
Quality/Safety Certification: 0.00


ZX-D2 remove and place chips
touch screen operate
hot air & IR
USB export and save
bga rework station for repair motherboard

ZX-D2 rremove and place chips,bga rework station

Features:

1. With PLC user interface control, display actual temperature of three zone and a test temperature curve, can export temperature profile;

2. With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;

3. Three heating zone with independent PID to control heating process, more stable and accurate;

4. Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;

5. After removal and welding with cooling fan to cool PCB board, ensure welding effect;

6. Temperature profile parameter with password protection;

7. Equipped with a variety size of hot-air nozzle, or made according to special requirements;

8. Build-in vacuum pump, no need gas sources.

 

 

SPECIFICATION

PCB Size

≤L500×W300mm

PCB Thickness

0.1~5mm

Temperature Control

K thermocouple  PID Closed loop

PCB Positioning mode

Outer

Bottom preheat

Infrared  2400W

Main (Top+bottom) heater

Hot air  800W+800W

Power supply

Single phase  220V,50/60Hz,4.0KVA

Dimension

L650×W700×H550mm

Weight

Approx. 40kgs

 

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