1.Infrared BGA rework station
2.Full infrared and operation by manual
5.Connect with computer
* Two independent heating zones, multitude temperature zones control, lead free process.
* Top heating zone use to infrared
* The bottom zone applies to far infrared to pre-heating to prevent PCB curve.
* Six-section temperature controls, simulates re-flower effect completely.
* Cools PCB after heating, to prevent PCB deflection.
* BGA welding on completion of the demolition, a voice prompt
* Vacuum wand sucks BGA, convenient, reliable and durable
* Card board with a special tooling for a wide variety of notebook motherboard(option )
* COM connection, connect with computer to achieve hi-end rework function.
* Infrared BGA rework station.
Normal Solder/Lead free
Have COM ,can connect PC
300mmL X 330mmW X 360mmH
Warranty: 1 year