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touch screen interface, plc control, bulid in vacuum pump, optical system, high-end and full-auto BGA rework station
touch screen interface, plc control, bulid in vacuum pump, optical system, high-end and full-auto BGA rework station

Minimum Order: 0
Quality/Safety Certification: 0.00


welding machine:
1.full automatic bag rework station
2.can handle PCB at any size
3.Movable heaters
4.use air compressor

Welding machine RW-E6250:

 

Specification:

PCB Maximum Size:450mm x400mm

Max Processing Area:120mm x 120mm

Max PCB Thickness:4mm

Max Component Size:70mm x 70mm

Min Component Size:4mm x 4mm

Max Component Weight:80g

Max Range of Vision:40mm x 40mm

Min Pitch:/0.30mm

Micrometer Adjust Range:

Front/Rear ± 10mm  Left/Right ± 10mm

Rotation Angle:360°

Max Hot Air Head Temp.:350° C

Max Lower IR Heat:400° C

Heat Control Adjustment:

8-Stage Programmable Temperature Settings

Upper heater power:1000W

 Lower heater power:1000W

 Bottom IR heater Power:3600W

 

1.Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function;
2.Color optical system with functions of split vision, zoom - in and micro-adjustment, equipped with berration detection device; with auto focus and software operation function,27X optical focus; able to rework BGA sized up to 70mm*70mm;
3.Touch screen interface, PLC control; able to display temperature curves and five detecting curves at the same time;
4.Color LCD monitor;
5.Built-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
6.6 segments of temperature up (down) and 6 segments constant temperature control, more  than 50000 groups of  profile can be stored.; Profile analysis can be carried out on the touch screen and has the communication function as computers ,with software attached;
7.Able to arrive at three independent temperature zones, temperature and time can be displayed digitally on the touch  screen, able to rework CGA;
8.The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;
9.Suction nozzle can identify material and mounting height automatically, and can control the air  pressure within a  small range;
10.Both upper and lower hot-air heating head are movable on the IR preheating area to fit for reworking BGA in different  positions on PCB;
11. Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle;
12.Driven by the servo motor, the integrative hot air head can store 20 groups of different BGA heating points and register marks.

 

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