Forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily
Desk Reflow Oven Features:
Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200N+ is a fine temperature profile model with temp testing capable of lead-free soldering.
PC interface software control and visional operationReal-time temperature testing function fills the blank of SMT industry overall world for adjusting the temperature at the real time. Patented heater installation® for heating evenlyPatented forced air cycling and ventilating technology® for extremely uniform temperature profiling across the board.Patented oven door actuating device® for no vibration after PCB welding. Patented auto-open door technology® for higher efficiency on production and the door matched with seal device for keeping temperature. Active Ventilation function for exhaust gas emission. Exhaust purifying function for environment-friendly. Nitrogen inert and N2 saving design.
Temperature control segment | 40 segment, |
Temperature-zone numbers | Single-zone and multi-segment |
Temperature control system | PC control system ,SSR non-contact output |
Temperature accuracy | ± 2 ºC |
Warm-up time | 3min |
Temperature range | Room-temperature -360ºC |
Heating supply | Infrared ray + Hot air convection |
Effective working table area | 270mm * 230mm (less than A4) |
Welding time | 3min ± 1min |
Temperature curve | It can be set ,adjusted and tested according to the actual requirement . |
Cooling system | Transverse flow equal cooling |
Rated voltage | AC single-phase, 220V; 50Hz |
Rated power | 4.0KW |
Mean power | 1.8kw |
Weight | 45 kg |
Dimension | L * W * H 820* 460*310mm |
