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BGA Soldering Ball Diffenrent Size From 0.25mm~0.76mm,leaded or lead-free
BGA Soldering Ball Diffenrent Size From 0.25mm~0.76mm,leaded or lead-free

Minimum Order: 0
Quality/Safety Certification: 0.00


1.0.4mm BGA Solder Ball
2.using for soldering and unsoldering
3.leaded or lead-free solder ball
4. 20000 bottles inventory

 WDS Leaded and Lead-free BGA Solder Ball

 

Technical parameter:

diameter(mm)

 tolerance(mm)

 circularity

(mm)

grain / bottle

g/bottle (Net weight)

Sn63/pb37

Sn62/pb36/Ag2

Sn96/Ag3.5/o.5Cu

0.25

±0.01

<0.008

1000000

68.82

68.91

60.56

0.30

±0.01

<0.01

1000000

119.05

119.12

104.75

0.35

±0.01

<0.011

1000000

189.82

189.15

166.17

0.40

±0.012

<0.012

500000

140.98

141.07

124.06

0.45

±0.012

<0.013

500000

200.75

200.93

176.68

0.50

±0.015

<0.015

250000

137.73

137.86

121.20

0.55

±0.015

<0.016

250000

183.42

188.12

161.41

0.60

±0.018

<0.018

250000

237.80

238.46

209.26

0.65

±0.018

<0.018

250000

302.71

303.58

266.38

0.70

±0.020

<0.020

250000

378.10

378.96

332.73

0.76

±0.020

<0.020

250000

483.89

485.03

425.82\

 

 

 

Sn

Pb

Ag

Cu

Sb

Zn

Bi

As

Al

Fe

Sn63/pb37

63 ±0.8

37 ±1

_

<0.3

<0.1

<0.005

<0.03

<0.03

<0.005

<0.02

Sn62/pb36/Ag2

63 ±0.8

36± 1

2 ±0.5

<0.3

<0.1

<0.005

<0.03

<0.03

<0.005

<0.02

 

Physical specifications

melting point

 density

 conductivity

Thermal expansion coefficient

thermal conductivity

shear strength

tensile strength

Sn63/pb37

183

8.4

11.46

25.2

0.5

6200

7500

Sn62/pb36/Ag2

179

8.41

11.85

27.1

0.5

7540

7540

Other BGA Accessary

 

 

Heat Tape

Sloder Flux Plaste

Goot Wick

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