BGA Soldering Ball Diffenrent Size From 0.25mm~0.76mm,leaded or lead-free
Minimum Order: 0
Quality/Safety Certification: 0.00
1.0.4mm BGA Solder Ball
2.using for soldering and unsoldering
3.leaded or lead-free solder ball
4. 20000 bottles inventory
WDS Leaded and Lead-free BGA Solder Ball |
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| Technical parameter: diameter(mm) | tolerance(mm) | circularity (mm) | grain / bottle | g/bottle (Net weight) | Sn63/pb37 | Sn62/pb36/Ag2 | Sn96/Ag3.5/o.5Cu | 0.25 | ±0.01 | <0.008 | 1000000 | 68.82 | 68.91 | 60.56 | 0.30 | ±0.01 | <0.01 | 1000000 | 119.05 | 119.12 | 104.75 | 0.35 | ±0.01 | <0.011 | 1000000 | 189.82 | 189.15 | 166.17 | 0.40 | ±0.012 | <0.012 | 500000 | 140.98 | 141.07 | 124.06 | 0.45 | ±0.012 | <0.013 | 500000 | 200.75 | 200.93 | 176.68 | 0.50 | ±0.015 | <0.015 | 250000 | 137.73 | 137.86 | 121.20 | 0.55 | ±0.015 | <0.016 | 250000 | 183.42 | 188.12 | 161.41 | 0.60 | ±0.018 | <0.018 | 250000 | 237.80 | 238.46 | 209.26 | 0.65 | ±0.018 | <0.018 | 250000 | 302.71 | 303.58 | 266.38 | 0.70 | ±0.020 | <0.020 | 250000 | 378.10 | 378.96 | 332.73 | 0.76 | ±0.020 | <0.020 | 250000 | 483.89 | 485.03 | 425.82\ |
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| | Sn | Pb | Ag | Cu | Sb | Zn | Bi | As | Al | Fe | Sn63/pb37 | 63 ±0.8 | 37 ±1 | _ | <0.3 | <0.1 | <0.005 | <0.03 | <0.03 | <0.005 | <0.02 | Sn62/pb36/Ag2 | 63 ±0.8 | 36± 1 | 2 ±0.5 | <0.3 | <0.1 | <0.005 | <0.03 | <0.03 | <0.005 | <0.02 |
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Physical specifications | melting point | density | conductivity | Thermal expansion coefficient | thermal conductivity | shear strength | tensile strength | Sn63/pb37 | 183 | 8.4 | 11.46 | 25.2 | 0.5 | 6200 | 7500 | Sn62/pb36/Ag2 | 179 | 8.41 | 11.85 | 27.1 | 0.5 | 7540 | 7540 |
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Other BGA Accessary
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Heat Tape Sloder Flux Plaste Goot Wick |