bga rework machine (RW-E6250)
optical, touch screen
OEM,ODM and MOQ at 1 set
1 year warranty,CE and ISO
High automatic
optical alignment high-auto bga rework machine(RW-E6250)
Specifications: (RW-E6250) | |
PCB dimension | W20*20~400*450mm |
PCB thickness | 0.5~4mm |
Working table adjustment | +/-10mm forward/backward , +/-10mm left/right |
Temperature control | K-type thermocouple, close cycle controlled |
PCB locating | Outer or jig |
Upper heater | Hot gas 1000w |
Lower heater | Hot gas 1000w |
Bottom preheat | Far infrared 3600w |
Power supply | Single -phase 220v,50/60Hz. 5.5kw |
BGA dimension | 1*1~70*70mm |
Min pitch of BGA ball | 0.15mm |
Placement precision | 0.01mm |
Max BGA weight | 300g |
Machine dimension | L780*W850*H950mm |
Gas supply | 5~8kgf/cm2, 60L/min |
Machine weight | Approx. 150kg |
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For more information ,please contact our Shuttle Star team ! |
