High quality, low price is sold to Japan in Taiwan, and other countries
Green silicon carbide micropowder for wire-sawing semiconductor matrerial.
Special green silicon carbide micropowder is used for the wire saw of monocrystalline silicon, polycrystalline silicon, potassium arsenide and quartz crystal. Green silicon carbide powderis the engineering processing material for solar industry, semiconductor industry and piezoelectric industry.
Features:
1.High purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition.
2.Grains are isometric with sharp edge, which ensure the even self-sharpening capability as cutting material and minimum TTV of the products been cut.
3.Particle size distribution is narrow and even.
4.High heat-resisting and refractoriness under load guarantee the small wire expansion in processing, suitable to all kinds of wire saw machine.
5. Grain surface possessed specially, and easily fit cutting fluid, such as polyethyleneglycol.
Chemical composition:
GC/JIS 1200# :
D50:9.5 ±0.8 SiC:98.5%min Fe2O3:0.2%max F.C :0.2%max PH value:6-8
| Particle size distribution (micron) | Chemical Index | Physical Index | ||||||
Size | D3 | D50 | D94 | SiC ≥(%) | Fe2O3 ≤(%) | F•C ≤(%) | PHValue | Density of heap | Magnetic Materials≤(%) |
GC#800 | ≤20.0 | 14.0±1.0 | ≥9.0 | 99.00 | 0.20 | 0.2 | 6--8 | 1.18 | 0.008 |
GC#1000 | ≤18.3 | 11.5±1.0 | ≥7.0 | 98.50 | 0.20 | 0.2 | 6--8 | 1.15 | 0.008 |
GC#1200 | ≤17.5 | 9.5±0.8 | ≥5.5 | 98.50 | 0.20 | 0.2 | 6--8 | 1.13 | 0.005 |
GC#1500 | ≤14.5 | 8.0±0.6 | ≥4.5 | 98.00 | 0.20 | 0.2 | 6--8 | 1.12 | 0.005 |
GC#1800 | ≤13.5 | 7.0±0.6 | ≥4.2 | 98.00 | 0.20 | 0.2 | 6--8 | 1.05 | 0.005 |
GC#2000 | ≤13.0 | 6.7±0.6 | ≥4.0 | 98.00 | 0.20 | 0.2 | 6--8 | 1.00 | 0.005 |
