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single sided FR-4 Rigid pcb board
single sided FR-4 Rigid pcb board

Minimum Order: 0
Quality/Safety Certification: 0.00


1.PCB Prototypes,Fabrication and Production
2.Over 10 years in PCB filed
3.Top quality with best price
4.ISO,UL,RoHs,SGS ec

We can produce single-sided printed board(ssb), double-sided printed board(dsb), multilayer PCBs, HDI PCBs, FPC and PCBA according to your provided data files or your samples.

HECPCB CAPABILITY-High Volume Conventional PCB

Surface

Gold plating\HAL\OSP\Gold finger

Raw Material

FR4, FR5(High TG), CEM-1, AI-base…

Max. Board Size

600mm*800mm

Min. Board Size

5mm*5mm

Warp age

Single-side<1.0%,Double-side<0.6%,Multilayer<0.6%

Min. Thickness & Tolerance

0.2mm+0.08mm

Min. Line Width / Space & Tolerance

HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%)

Copper to Edge-board Spacing

0.5mm (20mil)

Hole side to Edge-board Spacing

0.3mm (7.87mil)

Min. Hole Size & Tolerance

Size: 0.1mm/4mil(laser hole)

Tolerance: +0.075mm/3mil for PTH Diameter;  +0.05mm/2mil for Non-PTH Diameter

Min. Hole Space & Tolerance

0.4mm+0.076mm (15.75mil+3mil)

Hole Wall Thickness

20-25um (0.79mil-1.0mil)

Hole Position Deviation

+0.076mm (+3mil)

Min. Round Hole Dia.(for Punch)

1.0mm(40mil) with PCB thickness <FR-4 1.0mm;

1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil)

Min. Square Figure hole Dia.(for Punch)

0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm;

1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil)

Finished Board Size Tolerance

CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil)

V-cut Position Tolerance

+0.2mm(+8mil)

Base Material Thickness

0.2-3.5mm

Base Material Copper Thickness

18um, 35um, 70um

Electrolytic Flash Gold with thickness of 0.4 to 3.0 micro inches

Au: 0.01 to 0.076 micron; Ni: 5~15mm

Selective Immersion Gold with thickness of 1 to 4 micro inches

Au: 0.025 to 0.1 micron; Ni: 2.54~5.5mm

Gold tab/finger plating with thickness of 5 to 30 micro inches

Au: 0.125 to 0.76 micron; Ni: 1.27~12mm

Electroless Immersion Tin with thickness of 20 to 48 micro inches

05 to 1.2 micron

Organic solder ability Preservatives

Entek Cu 106A HT, Prefulx F2 LX

 

 

HECPCB Factory overview- Equipment list

Cut Copper Foil Machine

Auto.Flash Gold Plating Line(Cu/Ni/Au)and  line for (Cu/Sn)

Cut Prepreg Machine

Scrubbing Machine (I. S)

Scrubbing Machine

Auto. Printing Machine

Auto Cut Sheet Laminator

Conveyor Oven

Exposer

Electroless Nickel/Gold Plating Line

Developer,Etching & Stripping Machine

Immersion Tin Auto. Line

Black Oxide Line & Oven

Gold –Finger Plating Line

Auto. Vacuum Laminator

Horizontal HAL Machine

X-ray Trarget Hole Drilling Machine

Punching Machine

CNC Drilling Machine / Laser drilling machine (Japan)

CNC Routing Machine

Programmer

Bevelling Machine

Registration Drill

CNC V-cut Machine

Drill Sharpener

E-Tester

Auto.Desmear & PTH Line

Fly Probe Tester

Auto. Panel Plating Line

Organic Coating Line

Scrubbing Machine(IS)

Auto.Film Processor

Developer

CAM Station(Orbotech Genesis 2000)

 

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