1.Base Material:FR4
2.layer:2-layer
3.ULIS9001 certificater
4.High quality and competitive price
1.Base Material:FR4
2.layer:2-layer
3.board thickness:0.8mm
4.copper thickness:1oz
5.surface finish:Immersion tin6.soder mask:green
Reamrks
1.Transportation by air,by ship,by express,up to you.
2.Normally package:Inner,by vaccum.out by stardard export carton.
3.payment:by T/T or L/C
4.Delivery date:sample 5-7days.production:7-15days
5.High quality and competitive price
6.Technology strengthen.
IPC 6012 class3
TS16949
Welcome to.......Tian Wei Sheng
We manufacture Printed Circuit Board:High quality with competitive price(Good tolerance,Good warpage,Good solderable...)
The information about our company's process capacity for your reference:
| Specification Inch (mm) | |
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium | |
Layer No. | 1-30 | |
Board thickness | 0.015"(0.4mm)-0.125"(3.2mm) | |
| ||
Board Thickness Tolerance | ±10% | |
Cooper thickness | 1/2OZ-3OZ | |
Impedance Control | ±10% | |
Warpage | 0.075%-1.5% | |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) | |
| ||
Min Trace Width (a) | 0.005"(0.125mm) |
|
Min Space Width (b) | 0.005"(0.125mm) | |
Min Annular Ring | 0.005"(0.125mm) |
|
SMD Pitch (a) | 0.012"(0.3mm) |
|
BGA Pitch (b) | 0.027"(0.675mm) | |
Regesiter torlerance | 0.05mm | |
| ||
Min Solder Mask Dam (a) | 0.005"(0.125mm) |
|
Soldermask Clearance (b) | 0.005"(0.125mm) | |
Min SMT Pad spacing (c) | 0.004"(0.1mm) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
| ||
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) | |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) | |
Aspect Ratio | 6:1 | |
Hole Registration | 0.004"(0.1mm) | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel 3-7um Au:1-3u'' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) | |
Beveling | 30°45° | |
V-cut | 15° 30° 45° 60° | |
Certificate | ROHS ISO9001:2000 TS16949 SGS UL |