Multilayer chip balun:
1) multilayer monolithic construction yields high reliability;
2) low insertion loss
Multilayer chip balun:
Features:
1) multilayer monolithic construction yields high reliability;
2) low insertion loss and small size SMD chip design;
3) can simplify your complex tuning and circiut design;
Applications:
used in communication field,mainly used in WIFI;
Product identification:
MGMB 21 H 2 2450 B05
1) series name: MGMB
2) Dimension L*W: 21=2.0 mm*1.25mm ; 18=1.6mm*0.8mm
3)Design series: ( H: via design series, P: plane design series)
4)Impedance conversion: 1=50 ohm : 50 ohm, 2=50ohm:100 ohm, 3=50ohm: 200 ohm)
5) center frequency: 2450 MHZ
6) Balance type
Product specification:
Part No. | Dimensions L×W(mm) | Unbalance Port Impedance (Ω) | Balance Port Impedance (Ω) | Center Frequency (MHz) | Insertion Loss (dB) |
MGMB21H1-2450B05 | 2.0×1.25 | 50 | 100(50 +50) | 2450 | 1.0max.(at 25°C) |
MGMB21H1-2450B06 | 2.0×1.25 | 50 | 50(25 +25) | 2450 | 1.3max.(at 25°C) |
MGMB18H3-2450B08 | 1.6×0.8 | 50 | 200(100 +100) | 2450 | 1.2max.(at 25°C) |
MGMB18H4-2450B09 | 1.6×0.8 | 50 | Conjugate to Atheros IC | 2450 | 1.2max.(at 25°C) |
MGMB15H4-2450B10 | 1.0×0.5 | 50 | Conjugate to Atheros IC | 2450 | 1.4max.(at 25°C) |
