BD-COG80 Bonding machine is used to surface mount the IC with high accuracy of micro spacing on the glass substrate.
Features;
Main structure uses high-quality alloy steel; All electrical element uses the imported fittings with high accuracy and high stability, for ensuring the equipments software and hardware precision; IC localizing, XY servo motor driving, for ensuring the accuracy of IC localizing; IC automatic absorption, adjustment, reversal, photography, three-coordinate manual adjusting contraposition, integration completed COG bonding craft; Pre-press part uses the servo motor for driving the fluctuation and the pneumatic sliding table drives the indenter; The platform movements use the servo motor driving, ball bearing lead screw and double linear guide rail, for ensuring the precision of horizontal movement; PLC control system, man-machine interface operation, Chinese interface demonstration and with simple operation; 15 inch HD(High Definition) display used to the image registrationSpecifications ;
Item
Specification
LCD size
1~7 inch
IC size
Max: 30(L) * 5(W) *1.0(T) Min: 4(L) * 1(W) *0.4(T)
Number of indenters
3
Pallet Size
2*43*34*2
Welding spacing
Min: 20um
Bonding accuracy
Pre-press precision: ) Main press precision: )
Imagery processing system
Visual search gray 2pcs 1/3B/W CCD, 6Xlens image registration 15LCD image display
Pre-press pressure
1kgf~10kgf, adjust the cylinder pressure by the pressure regulating valve
Main press Pressure
2kgf~49kgf, adjust the cylinder pressure by the pressure regulating valve
Pre-pressing heating temperature scope
Constant temperature heating(RT~120 may be set by taking 1 as the unit)
Main pressing heating temperature scope
Constant temperature heating(RT~350 may be set by taking 1 as the unit)
Power Supply
AC220V 50/60Hz 2000VA
Rating Power
2000W
Air Supply
0.5~0.7(MPa)
Request of Air supply
Drynessdust removaloil removal
Vacuum source
Vacuum pump equipped
Size
1200(L) * 1000(W) * 1525(H)mm
Weight
500kg
Work line height
850mm
