Lead free solder cream SAC305
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Quality/Safety Certification: 0.00
high performance Lead free solder cream
1) Excellent wetting
2) Clean pin probe testable
3) RoSH
4) 24 hour stencil life
Stand lead free solder cream composition
Application Method | IPC Powder Type | Metal load |
Standard Stencil Printing | 3 | 90% |
Fine Pith Stencil Printing | 5 | 89.5% |
UItra-Fine Pitch Stencil Printing | 5 | 89% |
Dispensing syringes | 3 | 85% |
Note:These typical starting guide lines.To achieve optimal performance, actual metal load and particle size may vary per process, application, and envitonment. | ||
| Ingredient | Wt% | Chemical Formula | CAS No. | ||||
| Tin | 96.5±0.5 | Sn | 7440-31-5 | ||||
| Silver | 3.0±0.5 | Ag | 7440-22-4 | ||||
| Copper | 0.5±0.1 | Cu | 7440-50-8 | ||||
| Lead | ≤0.05 | Pb | 7439-92-1 | ||||
| Stibium | ≤0.05 | Sb | 7440-36-0 | ||||
| Bismuth | ≤0.10 | Bi | 1304-85-4 | ||||
| Zinc | ≤0.002 | Zn | 5970-45-6 | ||||
| Aluminium | ≤0.002 | Al | 637-12-7 | ||||
| Cadmium | ≤0.002 | Cd | 7440-43-9 | ||||
| Modified Rosin A | 38.0±0.5 | - | 65997-05-09 | ||||
| Modified Rosin B | 16.0±0.5 | - | |||||
| Organic Solvent | 46.0±0.5 | - | |||||
