Environmentally friendly; Non-hydrophilic, good solderability even under high temperature and humidity

     Sn-0.3Ag-0.7Cu lead free solder paste:

 

Model NO. ZXRM302P

 

Melting point: 217-227oC

 

Characteristics:    

Printing characteristic: good solderability even at peak temperature     Usage: if the solder paste is taken out of the refrigerator, it must be placed at an environment of 25 for about 4 hours so as to make its temperature return to indoor one before any scraping, shoveling, stirring etc. Otherwise, the cold solder paste may be damped, causing tin balls.     Printing conditions: As it is non-hydrophilic, the solder paste should be used at indoor temperature or under an environment of relatively high humidity, the maximum of which could reach 80%.