1.with or without adheive
2.semi-rigid /shrink ratio:6:1
3.shrink temperature:135 degree
4.high shrink ratio
5.halogen free
test item | test method | test result |
Tensile Strength | ASTM D2671 | ≥ 14 Mpa |
Ultimate Elongation | ASTM D2671 | ≥ 600% |
Heat Aging Tensile Strength Ultimate elongation | ASTM D2671 150 oC for 168 hrs | > 14MPa > 400% |
Heat Shock at 200 oC for 4 hrs | ASTM D2671 | No drop/No flow |
Low Temperature Flexibility at -55 oC for 4 hrs | ASTM D2671 | No cracking |
Dielectric Strength | ASTM D2671 | >18kV/mm |
Volume Resistivity | ASTM D2671 | >1015Ω.cm |
Water absorption | ASTM D570 | <0.3% |
Copper Corrosion | ASTM D2671 | Pass |
Softening Point | ASTM E28 | 90 ± 3 oC |
Peel Strength (XLPE) | ASTM D2671 | >30N/cm |
Peel Strength (Metal) |
|
|
Adhesive at -25 oC for 4 hrs | - | No cracking |
Product Selection
Product code | ID before shrink | ID after shrink | wall thinkness after shrink | standard length(m/pce) |
(mm/inch) | (mm/inch) | (mm) | (m/inch) | |
S4-Φ 19/3.2 | 19/0.75 | 3.2/0.13 | 3.8 ± 0.15 | 1.22/48 |
S4-Φ 33/5.5 | 33/1.30 | 5.5/0.22 | 4.5 ± 0.15 | 1.22/48 |
S4-Φ 45/7.5 | 45/1.77 | 7.5/0.30 | 5.0 ± 0.15 | 1.22/48 |
S4-Φ 55/9.2 | 55/2.17 | 9.2/0.36 | 5.0 ± 0.15 | 1.22/48 |
S4-Φ 66/11 | 66/2.60 | 11.0/0.43 | 5.5 ± 0.15 | 1.22/48 |
S4-Φ 76/12.7 | 76/2.99 | 12.7/0.50 | 5.5 ± 0.15 | 1.22/48 |
S4-Φ 87/14.5 | 87/3.43 | 14.5/0.57 | 5.5 ± 0.15 | 1.22/48 |
S4-Φ 115/19.2 | 115/4.53 | 19.2/0.76 | 5.5 ± 0.15 | 1.22/48 |
S4-Φ 160/26.6 | 160/6.30 | 26.6/1.05 | 5.5 ± 0.15 | 1.22/48 |
S4-Φ 178/29.6 | 178/7.01 | 29.6/1.17 | 6.0 ± 0.15 | 1.22/48 |
S4-Φ 235/40 | 235/9.25 | 40.0/1.57 | 6.0 ± 0.15 | 1.22/48 |